Ingxelo yabucala: Ubumfihlo bakho bubaluleke kakhulu kuthi. Inkampani yethu ithembisa ukungazivezi iinkcukacha zakho kuye nakuphi na iimvume zakho.
Ngemfuno eyandayo yeetshipsi kwimimandla eyahlukeneyo njengezixhobo zonxibelelwano, i-elektroniki yombane, i-Automotive, njl. Inkqubo yokwenziwa kwe-chip inzima kakhulu, xa ifikile kwimveliso ye-semicondcucy, ingqwalaselo eninzi ihlala ihlawulwe kwi-sefir ye-silicon ye-eilicon, irhasi ye-elektroniki, iifoto, ii-Shows, eziPhezulu, ezinye izinto ezinxulumene noko umgcini ongabonakaliyo - iplastiki.
Owona mngeni mkhulu ujongene nemveliso ye-semiconductor kukulawula ukungcoliseka, ngakumbi ngokuphuhliswa kweTekhnoloji ye-semicondcuctor, izinto ze-elektroniki zikhula kancinci kwaye zisezantsi, ukuveliswa kweemeko ezinzima, ukuphakama Iqondo lokushisa, imimandla yemichiza ezonakalisayo.
Kuyo yonke le nkqubo ye-semicondcuctor, indima yePlastiki ngokuyintloko iphakethwe kunye nezothutho, edibanisa inyathelo ngalinye lokuqhuba, ukuthintela ungcoliseko kunye nomonakalo ongcolisayo, kunye nokuphucula isivuno seenkqubo ze-semiconductor. Izinto zeplastiki ezisetyenzisiweyo zibandakanya i-POSE, i-PPS, iphe, ABS, i-PVC, PV, iFluoroplastics, i-Pluoroplastics, i-Pluoroplastics, i-Pluoroplastics, njl. Njl.
Oku kulandelayo kugxilwe kwisicelo se-ofisi yePlastali yePlastity yePlastali / i-PPs kwimveliso ye-semicondcuction.
I-1, i-CMP inomsesa
I-Chemical Memoting Meparaction (CMP) yinkqubo yetekhnoloji yenkqubo yemveliso yenkqubo, i-CMP esetyenzisiweyo isetyenziswa kwinkqubo yokuGcina ukulungisa i-wafer, i-wafer, ukuzinza kwezinjongo kufuneka kube nokunganyangeki kakuhle, ukumelana nemichiza yekhemikhali, Kulula ukuqhubekeka, ukuphepha i-crystal wafer / i-wafratches yokuphumla, ungcoliseko.
I-CMP isetyenziselwa ukulungisa i-wafer kwinkqubo yokugaya, izinto ezikhethiweyo kufuneka zikuphephe ukuqhekeza umphezulu wokukrwada, ukungcoliseka, njl njl.
I-Peek inozinzo oluphezulu, kulula ukuqhubekeka, ukuxhathisa amashishini amahle kunye nokunganyangeki kwekhemikhali, ukuthelekiswa ne-PPS ye-CPS, i-PRET iphindwe kabini, ngaloo ndlela kuncitshiswa ixesha lokuphumla Ukuphucula amandla emveliso enesikhubekiso.
Izixhobo: I-Peek, PPS
2. I-Warriers
I-Wafer Parriers, njengoko igama libonisa ukuba ifake i-wafer, ibhokisi ye-wag I-Wafirs igcinwe kwibhokisi yokuthutha kuyo yonke inkqubo yemveliso ye-akhawunti yexesha, ibhokisi ye-wafer ngokwayo, umbandela, umgangatho kunye nococeko lunokuba nefuthe elikhulu okanye elincinci kumgangatho we-wafr.
I-Waferiests inkqonkqoza ngobushushu ngokubanzi, iziqu ezibalaseleyo zendlela, uzinzo oluhle, oluchasene ne-ruggic, izixhobo eziphantsi, iinkqubo eziphantsi, iinkqubo ezisetyenziswayo, iinkqubo ezahlukeneyo ezisetyenziswa kwizinto ezikhethiweyo.
I-Peek ingasetyenziselwa ukwenza inkqubo yokudluliselwa ngokubanzi kunye nabathwali, i-Peek ineempawu ezininzi ezintle, i-antistating, i-antistatic kunye nokunganyangeki, ukuncedisa ukuthembeka kokuphathwa kwelanga , ukugcinwa nokudluliselwa.
Izixhobo zibandakanya: I-PEE, PFA, PFA, PP, PS, PC, PC, PEI, PEI, NJANI.
3. Ibhokisi yemaski yemaski
IfotoK yinkqubo yokwenza i-chip yemveliso esetyenziswa kwi-prografic programe, idityaniswe nge-chrome yensimbi, ukusetyenziswa komthombo wokukhanya okuphezulu kwi-Willicon Wafen Invent enokuboniswa Ipateni. Naluphi na uthuli okanye ukukrwada eziqhotyoshelwe kwifotokli kuya kubangela ukonakala komfanekiso oqikelelweyo, ngoko kuyafuneka ukunqanda ungcoliseko lwefoto, kwaye ukuphepha amasuntswana achaphazelekayo ukungcola kwefoto.
Ukwenzela ukuthintela ukonakala okubangelwe kukugqobhoza, ukuxabana, okanye ukususwa kwemaski, ibhokisi yemaski yenziwa ngokuthi ye-anti-static, ephantsi kakhulu, kunye nezixhobo ezibiweyo.
Ubunzima obukhulu, isizukulwana esiphantsi kakhulu, ukucoceka okuphezulu, ukungavisisani kwamachiza, ukunganyangeki kwe-raceric, kwimveliso, kwimveliso kunye nokuhambisa iifoto kwinkqubo ye Iifoto, ukuze iphepha lefoto ligcinwe kwi-ofisi ephantsi yokuphuma kunye ne-Ionic ephantsi kwindalo esingqongileyo.
Izixhobo: I-Anti-Static Peek, i-Anti-Static PC, njl.
IZIXHOBO ZEMIXO
Izixhobo ezisetyenziselwa ukukhupha i-wafmp ye-wafers okanye i-silicon ye-sifle, ezinje ngamaqhina afe, i-vacuum wicum, njl njl.
I-Peek iphawuleka ngokuxhathisa ubushushu obuphezulu, ukuxhathisa i-abrasion, uzinzo oluhle, olusemgangathweni oluphantsi, kunye ne-hygroscoficiccicity. Xa i-waficon ye-silicon ye-selicon igqunywe ngamaqhina e-Peek Wafe, akukho sikhuhlayo kumphezulu we-waficon kunye ne-safnon ye-silicon, kwaye akukho ntsali ye-sefur, ephucula ukucoceka komphezulu we-wafers kunye ne-silicon ye-silicon.
Izixhobo: I-Pek
5.SemicioSuctor Iphakheji yePakethi
Vavanya isokisi kwisekethe ngqo yecandelo ngalinye le-semicondcuctor elixhunyiwe kwisixhobo sovavanyo kwisixhobo, iziseko ezahlukeneyo zovavanyo zisetyenziselwa ukuvavanya abaqulunqi beesekethe ezihlanganisiweyo ezichazwe zii-microchips. Izixhobo ezisetyenziselwa iziseko zovavanyo kufuneka zihlangabezane neemfuno zokuzinza kobushushu obubanzi, amandla omatshini, ukuqulunqwa kwe-burr, ukuqina, kunye nokwenza lula.
Izixhobo: I-Peek, PPS, PPS, Pai, PI, PEI
November 14, 2024
November 13, 2024
October 20, 2022
October 20, 2022
I-imeyili kule mthengisi
November 14, 2024
November 13, 2024
October 20, 2022
October 20, 2022
Ingxelo yabucala: Ubumfihlo bakho bubaluleke kakhulu kuthi. Inkampani yethu ithembisa ukungazivezi iinkcukacha zakho kuye nakuphi na iimvume zakho.
Gcwalisa ulwazi oluthe kratya ukuze unxibelelane nawe ngokukhawuleza
Ingxelo yabucala: Ubumfihlo bakho bubaluleke kakhulu kuthi. Inkampani yethu ithembisa ukungazivezi iinkcukacha zakho kuye nakuphi na iimvume zakho.